製品詳細情報

半導体製造装置

【DAS2000　ケミカルドライエッチャー】 DAS series is the latest generation 200mm Ashing and Etching System with increased productivity and it design with the smallest footprint for 200mm System. The system provided high quality process performance, consistency and high precision compared to previous model. A multi-source Platform is designed for installing Microwave, FCIP or Advanced ICP, depending on the customer\'s application purpose. RF Bias can be used for both Ashing system (Descum) and Etching application. In addition to DAS series innovative process advancements, Major improvement in system reliability have been achieved through easier HW maintenance and field Proven customized SW. DAS series can be flexible wafer size transfer and process.

【PROFILER】 PROFILER is a new generation Multi-Application system that performs Pattern Profiling and Plasma Oxide Dry Cleaning (POC) utilizing a Point Inductively Coupled Plasma (PICP) source for semiconductor manufacturing under the 3Xnm design processes. It supports a wide process window utilizing chuck & baffle temperature controls, high & low Etch Rates (50~600 angstrom/min), and good wafer Uniformity (under the 3.0%). Performance, low particle control, and outstanding reliability make the Profiler a highly attractive and effective low-cost solution for various application purposes.